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8 GPU HGX B300 AI server, liquid cooled

Direct liquid cooled HGX B300 node in a 4U chassis with eight B300 GPUs, NVLink and NVSwitch, 8 x 800 Gb/s ConnectX-8, built for high density racks.

Illustration of a 4U liquid cooled GPU server with its cold plate manifold and rear coolant couplings
GPUs
8 x NVIDIA B300, 288 GB HBM3e each, NVLink and NVSwitch, cold plates on GPUs and switches
CPU
2 x AMD EPYC 9005 or 2 x Intel Xeon 6, liquid cooled
Memory
Up to 3 TB DDR5 RDIMM
Storage
2 x M.2 boot, up to 8 x E3.S NVMe
Networking
8 x 800 Gb/s ConnectX-8 (east west), 2 x 400 Gb/s BlueField-3 (north south)
Cooling
Direct to chip, facility water through rack manifold and CDU

Overview

The liquid cooled HGX B300 node puts the same eight B300 GPUs, NVLink domain and ConnectX-8 fabric into a 4U chassis with cold plates on the GPUs, NVSwitch and CPUs. Heat goes to facility water through quick disconnects and a rack manifold, so eight or more nodes fit in one rack and the GPUs can run at their full rated power without acoustic or airflow limits.

It is the right choice for new halls designed around liquid cooling and for high density retrofits where a coolant distribution unit can be added. We quote the node with the rack manifold, the CDU sizing and the remaining air cooled share so that the facility design has a complete heat budget rather than a per node figure alone.

Host configuration mirrors the air cooled class: dual AMD EPYC 9005 or Intel Xeon 6, DDR5 memory to 3 TB, mirrored boot and up to eight E3.S data drives, and 400 Gb/s BlueField-3 frontend. Burn in is carried out on a liquid test bench before shipment and the acceptance report includes leak testing and coolant flow checks.

Use cases

  • High density LLM training clusters
  • Liquid cooled AI factories
  • Dense inference fleets
  • Retrofits with rack level CDUs

Specifications

Compute
GPUs8 x NVIDIA B300 on the HGX B300 baseboard
GPU memory288 GB HBM3e per GPU, 2.1 TB per node as published by NVIDIA
GPU interconnectFifth generation NVLink, 1.8 TB/s per GPU, NVSwitch
CPUs2 x AMD EPYC 9005 series or 2 x Intel Xeon 6
System memory24 or 32 x DDR5 RDIMM, up to 3 TB
Storage
Boot2 x M.2 NVMe, mirrored
DataUp to 8 x E3.S NVMe, 7.68 TB to 15.36 TB each
ExpansionShared storage over the 400 Gb/s frontend network
Networking
GPU fabric8 x 800 Gb/s InfiniBand or RoCE, ConnectX-8, OSFP
Frontend2 x 400 Gb/s, BlueField-3, QSFP112
ManagementDedicated 1 GbE BMC port, TPM 2.0
Cooling and power
Form factor4U rackmount, direct liquid cooled
Liquid loopCold plates on GPUs, NVSwitch and CPUs, quick disconnects to rack manifold
Heat to liquidRoughly 80 percent of node heat rejected to facility water, remainder to air
Planning powerAbout 14 kW per node, with GPUs able to run at full TGP
Power suppliesRedundant PSUs, 200 to 240 V input

Figures describe the system class. Exact configuration, weights and power draw are confirmed on the quotation.

What's included

  • Rails, power cords and cable management arm
  • Burn in with multi hour GPU stress and NVLink validation, acceptance report
  • NVIDIA end user registration handled with the order
  • Operating system imaging, driver and fabric manager baseline on request
  • 3 year warranty, options to 5 years with advance replacement
  • Rack manifold connectors and leak test certificate

Compliance

Compare it with the next class up or down

The nearest classes we quote are the 8 GPU HGX B300 AI server, air cooled and the 16 node HGX B300 AI pod, 128 GPUs. If neither is quite right, tell us the workload and we specify the system between them.